Not yet a member?Join now!|Lost password
10/10/2012 | Press release
distributed by noodls on 10/11/2012 03:35
FOR IMMEDIATE RELEASE
Carl Buck Marilynn Meek
V.P. of Marketing Analyst/Investor Contact
(510) 623-9400 x381 (212) 827-3773
2013.
"We believe it is very significant that this customer is
working with us to develop our next generation FOX-1 system."
said Carl Buck, vice president of marketing at Aehr Test
Systems. "This new FOX system is designed to provide the
customer with increased test flexibility and capability at a
significantly lower cost of test than alternative solutions
while also expanding the markets addressed by our FOX full
wafer test products."
The FOX-1 full wafer parallel test system has the capability
to test thousands of die in a single touchdown, thus
providing a cost-effective solution for devices with long
test times such as flash and microcontrollers with embedded
flash. Other members of Aehr Test's FOX family of products
are focused on long-duration full wafer burn-in and test of
products such as automotive ICs, MCUs, DRAMs and VCSELs
(laser diodes).
Headquartered in Fremont, California, Aehr Test Systems is a
worldwide provider of test systems for burning-in and testing
logic and memory integrated circuits and has an installed
base of more than 2,500 systems worldwide. Increased quality
and reliability needs of the Automotive and Mobility
integrated circuit markets are driving additional test
requirements, capacity needs and opportunities for Aehr Test
products in package and wafer level test. Aehr Test has
developed and introduced several innovative products,
including the ABTSTM and FOX family of test and
burn-in systems and the DiePak® carrier. The ABTS system is
used in production and qualification testing of packaged
parts for both low-power and high-power logic as well as all
common types of memory devices. The FOX system is a full
wafer contact test and burn-in system used for burn-in and
functional test of complex devices, such as leading-edge
memories, digital signal processors, microprocessors,
microcontrollers and systems-on-a-chip. The DiePak carrier is
a reusable, temporary package that enables IC manufacturers
to perform cost-effective
1 of 2
final test and burn-in of
bare die. For more information, please visit the Company's
website at www.aehr.com.
This release contains forward-looking statements that involve
risks and uncertainties relating to projections regarding
customer demand and acceptance of Aehr Test's products.
Actual results may vary from projected results. These risks
and uncertainties include, without limitation, acceptance by
customers of the FOX and WaferPak contactor technologies,
acceptance by customers of the WaferPak contactors shipped
upon receipt of a purchase order and the ability of new
products to meet customer needs or perform as described. See
Aehr Test's recent 10-K, 10- Q and other reports from time to
time filed with the Securities and Exchange Commission for a
more detailed description of the risks facing our business.
The Company disclaims any obligation to update information
contained in any forward-looking statement to reflect events
or circumstances occurring after the date of this press
release.
###
2 of 2